Package and footprint — 8-VSSOP
The SN65LVDS179DGKG4: The 8-VSSOP (also described as 8-TSSOP/MSOP with 0.118-inch, 3.00 mm width) is a fine-pitch surface-mount package. The exposed pad (if present on this variant) is not a thermal pad; it is tied to GND and helps with signal integrity, not heat sinking.
The part is RoHS-compliant — the 'G4' suffix in the order code indicates TI's green/RoHS-compliant plating finish.
