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Texas Instruments SN65LVDS104DR — Interface & Transceivers

TI SN65LVDS104DR LVDS Buffer Multiplexer, 400 Mbps, 16-SOIC

MPNSN65LVDS104DR
End of Life

Texas Instruments SN65LVDS104DR, LVDS Buffer and Multiplexer, 1 x 1:4 fanout, 400 Mbps data rate, 3.1 ns delay, 3 V to 3.6 V supply, 23 mA supply current, -40°C to 85°C, 16-SOIC package, Tape & Reel.

$2.6275Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

SN65LVDS104DR specifications
ParameterValue
TypeBuffer, Multiplexer
MountingSurface Mount
Supply voltage3V ~ 3.6V
Current - supply23mA
Operating temperature-40°C ~ 85°C
InputLVDS
OutputLVDS
PackageTape & Reel (TR)
Delay time3.1ns
ManufacturerTexas Instruments
Case16-SOIC (0.154\", 3.90mm Width)
Data rate400Mbps
Channels1 x 1:4
Capacitance - input3 pF

Product details

The Texas Instruments SN65LVDS104DR is a 1:4 LVDS buffer and multiplexer that takes one differential LVDS input and distributes it to four LVDS outputs. It is designed for clock and data distribution in high-speed digital systems where signal integrity over backplanes, cables, or PCB traces matters. Each output channel handles data rates up to 400 Mbps with a propagation delay of 3.1 ns, making it suitable for distributing serial links, clock signals, or parallel LVDS busses in telecom infrastructure, industrial automation, and test equipment.

400 Mbps per channel and 3.1 ns delay — the timing budget

The 400 Mbps data rate per output is the headline performance spec. In a clock distribution application, the 3.1 ns propagation delay means the output edges arrive about three nanoseconds after the input edge. For matched-length routing, you budget that delay into the overall skew calculation. The 3 pF input capacitance is low enough that a single LVDS source can drive the SN65LVDS104DR without extra buffering, even over a few inches of board trace.

16-SOIC package — board-level fit

The narrow SOIC footprint is common on mixed-signal boards where LVDS fanout sits near the connector or backplane interface. No exposed thermal pad — the 23 mA supply current is low enough that the package dissipates without extra copper.

Frequently asked questions

What is the difference between SN65LVDS104 and SN65LVDS104DR?

The base part number SN65LVDS104 refers to the device family. The 'DR' suffix indicates Tape & Reel packaging for automated pick-and-place assembly.

Is SN65LVDS104DR RoHS compliant?

The SN65LVDS104DR is a lead-free, RoHS-compliant part as standard for TI's current production. The 16-SOIC package uses a nickel-palladium-gold (NiPdAu) finish that is compatible with lead-free reflow processes.