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Texas Instruments OPA859IDSGR — Memory (DRAM / SRAM / Flash / EEPROM)

TI OPA859IDSGR Op Amp, 1.8 GHz, 1150 V/µs, 8-WSON

MPNOPA859IDSGR
End of Life

Texas Instruments OPA859IDSGR general-purpose op amp, 1.8 GHz -3 dB bandwidth, 1150 V/µs slew rate, differential output, 8-WSON (2x2) package, active.

$4.92Ref. price · indicative, final on quote
Packaging8-WFDFN Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

OPA859IDSGR specifications
ParameterValue
Output typeDifferential
MountingSurface Mount
Amplifier typeGeneral Purpose
Voltage - input offset900 µV
Voltage - supply span5.25 V
Current - supply20.5mA
Current - output (Channel)105 mA
Operating temperature-40°C ~ 125°C
-3db bandwidth1.8 GHz
Gain bandwidth product900 MHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate1150V/µs
Case8-WFDFN Exposed Pad
Number of circuits1

Product details

1.8 GHz bandwidth, 1150 V/µs slew — what these mean on the bench

The OPA859IDSGR is a single-channel general-purpose operational amplifier from Texas Instruments, delivering a 1.8 GHz -3 dB bandwidth and a 900 MHz gain-bandwidth product. These figures mean it can amplify signals up to nearly 2 GHz before the gain drops by 3 dB — suitable for RF intermediate stages, high-speed ADC drivers, or wideband transimpedance amplifiers where preserving signal amplitude across frequency matters. Its 1150 V/µs slew rate ensures the output can track fast input transitions without slew-rate limiting, which would otherwise introduce nonlinear distortion on pulse edges or high-frequency sine waves. For a 1 V peak-to-peak output at 1.8 GHz, the required slew rate is roughly 11.3 V/µs — this part has over 100× margin, so slew-induced distortion is not a concern across the full bandwidth.

Package and thermal: 8-WSON with exposed pad

Housed in an 8-WFDFN exposed-pad package (supplier device package 8-WSON, 2 mm × 2 mm), the OPA859IDSGR is a surface-mount part with a thermal pad underneath. The exposed pad must be soldered to a PCB ground plane with thermal vias to achieve the datasheet thermal resistance — without this, the junction temperature rises above the -40°C to 125°C operating range under high output current or ambient heat. The 105 mA output current per channel means the part can drive 50-ohm loads to about 5.25 V swing — useful for driving transmission lines or high-speed ADC inputs directly. The 20.5 mA supply current is moderate for this speed class; the 3.3 V to 5.25 V supply span lets it run from a single 3.3 V or 5 V rail common in mixed-signal systems.

Active lifecycle and sourcing posture

The automotive-grade sibling OPA859QDSGRQ1 shares the same bandwidth and slew rate but adds AEC-Q100 qualification for -40°C to 125°C operation. If the end application requires automotive PPAP or reliability screening, the Q-grade variant is the drop-in replacement — same package, same pinout, same electrical performance.

Frequently asked questions

What is the closest functional second-source for OPA859IDSGR?

The OPA859QDSGRQ1 is the automotive-grade variant (AEC-Q100 qualified) with identical 1.8 GHz bandwidth, 1150 V/µs slew rate, and 8-WSON package. It drops into the same PCB footprint without rewiring. For non-automotive designs, the standard OPA859IDSGR is the primary choice; the Q-grade part serves as a pin-compatible alternative when automotive qualification is required.

What compliance documentation does Texas Instruments provide for OPA859IDSGR?

Texas Instruments certifies the OPA859IDSGR as ROHS3 Compliant. Standard documentation includes the datasheet, RoHS declaration, and material composition data. No UL or IEC certification is listed for this part; it is a semiconductor device, not a system-level safety component.