OPA857IRGTT

Texas Instruments

Texas Instruments OPA857IRGTT general-purpose op amp, single circuit, 220 V/µs slew rate, 130 MHz -3dB bandwidth, 23.4 mA supply, 16-VFQFN Exposed Pad, Tape & Reel.

Texas Instruments OPA857IRGTT
Download datasheet (PDF)
[IN STOCK] In Stock: 7 pcs
$7.82/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

OPA857IRGTT specifications
Parameter / AttributeSpecification / Value
MountingSurface Mount
Amplifier typeGeneral Purpose
Voltage - supply span3.6 V
Current - supply23.4mA
Current - input bias1 µA
Operating temperature-40°C ~ 85°C
-3db bandwidth130 MHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate220V/µs
Case16-VFQFN Exposed Pad
Number of circuits1

Technical details

130 MHz GBW, 220 V/µs slew rate — signal-chain fit

The OPA857IRGTT is a single-channel, general-purpose operational amplifier from Texas Instruments in a 16-VFQFN Exposed Pad package (3x3 mm VQFN). It delivers a 130 MHz -3dB bandwidth and a 220 V/µs slew rate, making it suitable for high-speed signal conditioning in test equipment, communications, and data acquisition front-ends. Supply span runs from 2.6 V to 3.6 V, drawing 23.4 mA quiescent current. The 1 µA input bias current is typical for a bipolar-input stage at this speed — budget the bias error into your DC accuracy calculation when the source impedance is above a few kilo-ohms.

Industrial temperature range, active lifecycle

Rated for -40°C to +85°C operating temperature, the OPA857IRGTT covers the industrial temperature band. Sourced through authorized and independent distribution channels; quoted to order against BOM quantities. Availability and current pricing confirmed at RFQ time.

Package and footprint — 16-VQFN (3x3 mm)

Housed in a 16-lead VFQFN with exposed thermal pad (supplier device package 16-VQFN, 3x3 mm). The pad must be soldered to a PCB copper plane for rated thermal performance — the datasheet layout recommendation ties the pad to the most negative supply rail (V-). Available in Tape & Reel or Cut Tape options. Surface-mount only; the 0.5 mm pitch QFN demands a solder-paste stencil designed for the exposed-pad aperture — a common cause of tombstoning or insufficient solder joint on the thermal pad.

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