Package and board integration
The OPA2990IDDFR comes in a TSOT-23-8 package (SOT-23-8 footprint), a 0.65 mm pitch surface-mount package that fits a standard two-layer board without micro-vias. The small body means the thermal path is through the leads and the copper pour under the part — keep a solid ground plane on the bottom layer to pull heat out of the die when driving the full 80 mA output per channel.
Parametric fit for signal conditioning
With a 1.1 MHz gain-bandwidth product and 4.5 V/µs slew rate, this dual op-amp handles audio-band filtering, sensor buffering, and control-loop conditioning up to about 100 kHz closed-loop gain. The 120 µA supply current per channel keeps the thermal budget low in a densely populated board — two amplifiers draw under 250 µA total quiescent. The rail-to-rail output stage swings within 50 mV of the supply rails at light loads, which matters when the ADC reference or comparator threshold sits near the supply. Input offset voltage is 300 µV max — adequate for 8- to 10-bit systems without auto-zeroing. Supply range spans 2.7 V to 40 V single supply, or ±1.35 V to ±20 V split. That 40 V ceiling covers 24 V industrial rails with margin for transients, and the 2.7 V floor lets it run from a single lithium cell or a 3.3 V rail with dropout headroom.
Temperature grade and deployment
Rated for -40 °C to 125 °C ambient, this is a full industrial-temperature part. The 10 pA input bias current stays under 1 nA even at 125 °C, so high-impedance sensor front-ends (photodiode transimpedance, pH probe buffers) don't drift off the rail as the board heats up.