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Texas Instruments NE5532APG4 — Analog & Data Acquisition

NE5532APG4 Dual Op-Amp, 10 MHz GBW, 9V/µs Slew Rate, PDIP-8

MPNNE5532APG4
End of Life

Texas Instruments NE5532APG4, dual general-purpose op-amp, 10 MHz gain bandwidth, 9V/µs slew rate, 8 mA supply per channel, 8-DIP through-hole package, 0°C to 70°C operating temperature.

$0.7600Ref. price · indicative, final on quote
Texas Instruments NE5532APG4 datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

NE5532APG4 specifications
ParameterValue
MountingThrough Hole
Amplifier typeGeneral Purpose
Voltage - input offset500 µV
Voltage - supply span30 V
Current - supply8mA (x2 Channels)
Current - input bias200 nA
Current - output (Channel)38 mA
Operating temperature0°C ~ 70°C (TA)
Gain bandwidth product10 MHz
PackageTube
Slew rate9V/µs
Case8-DIP (0.300\", 7.62mm)
Number of circuits2

Product details

10 MHz GBW, 9V/µs slew — the audio-workhorse dual op-amp

Supply range and quiescent current — fitting the rail budget

Each of the two amplifiers draws 8 mA quiescent current, so the total supply draw is 16 mA at no load — a figure to budget in the power rail sizing for a multi-stage audio chain.

Through-hole PDIP-8 — legacy footprint, repair-friendly

The 8-DIP (0.300-inch, 7.62 mm pitch) package is a through-hole footprint that fits standard prototyping boards and socket strips. It is well suited for bench testing, audio hobbyist builds, and field replacement on existing PCBs where an SMT rework station is not available. The supplier device package is 8-PDIP.

Frequently asked questions

What is the difference between NE5532APG4 and NE5532P?

The NE5532APG4 and NE5532P share the same base dual op-amp design and 8-PDIP package. The 'G4' suffix on the NE5532APG4 typically indicates a lead-free / RoHS-compliant plating finish, while the NE5532P may carry a different environmental compliance level. Both are active and functionally interchangeable in most circuits, but confirm the plating finish against your assembly process requirements.