MSP430G2553IRHB32R

Texas Instruments · MSP430G2xx Series

Texas Instruments MSP430G2xx series MSP430G2553IRHB32R, 16-bit MCU, MSP430 CPU16 core, 16 MHz, 16 KB Flash, 512 x 8 RAM, 24 I/O, I²C/SPI/UART, 8x10b ADC, 1.8 V to 3.6 V, -40°C to 85°C, 32-VFQFN exposed pad.

Texas Instruments MSP430G2553IRHB32R
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

MSP430G2553IRHB32R specifications
Parameter / AttributeSpecification / Value
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size512 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)24
Core processorMSP430 CPU16
Case32-VFQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size16KB (16K x 8)

Technical details

16 MHz, 16 KB Flash, 512 B RAM — what the memory budget means for your firmware

The MSP430G2553IRHB32R: The 512 x 8 RAM is the tightest constraint in this part. For a dedicated function like a temperature logger or a simple I²C bridge, it is workable with careful coding.

Peripherals and I/O — what is and is not on this die

The device provides 24 general-purpose I/O pins, an 8-channel 10-bit ADC, and serial connectivity covering I²C, SPI, and UART (with IrDA and LINbus support on the UART). There is no CAN, no USB, no DAC, and no external memory bus. Brown-out detect and POR are integrated, so an external reset supervisor is optional.

Package and footprint — 32-VFQFN with exposed pad

The package is surface-mount only; no DIP or SOIC variant exists for this order code.

For a production BOM line, this means no forced redesign cycle from obsolescence in the near term.

MSP430G2553IRHB32R
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