MSP430G2453IRHB32R

Texas Instruments

Texas Instruments MSP430G2xx series 16-bit MCU, MSP430G2453IRHB32R, 16 MHz, 8 KB Flash, 512 x 8 RAM, 24 I/O, 1.8 V to 3.6 V supply, -40°C to 85°C, 32-VFQFN exposed pad.

Texas Instruments MSP430G2453IRHB32R
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Technical specifications

MSP430G2453IRHB32R specifications
Parameter / AttributeSpecification / Value
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed16MHz
RAM size512 x 8
Core size16-Bit
PackageTape & Reel (TR) Cut Tape (CT)
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI2C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)24
Core processorMSP430 CPU16
Case32-VFQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size8KB (8K x 8)

Technical details

16 MHz 16-bit MCU with 8 KB Flash — what the specs mean for a low-power sensor node

Twenty-four general-purpose I/O lines are available, along with a 10-bit ADC (8 channels), I2C, SPI, UART, and LINbus connectivity.

8 KB Flash, 512 B RAM — sizing the firmware budget

Eight kilobytes of Flash is the program-storage ceiling. That fits a bootloader plus a modest application — think a temperature logger, a capacitive touch interface, or a LIN slave node. The 512-byte RAM is the tight constraint: stack, global variables, and any DMA buffers share that space. If your algorithm needs a large lookup table or a multi-packet serial buffer, you will hit the RAM wall before the Flash fills. The MSP430G2xx family includes parts with up to 16 KB Flash and 1 KB RAM if the headroom is insufficient.

The pad is also the only thermal path; without proper soldering, junction temperature rises quickly above 85°C ambient at high I/O activity.

No official second source exists within the MSP430G2xx family, but the base product number MSP430G2453 covers multiple package and temperature variants that share the same core and memory map.

MSP430G2453IRHB32R
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