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Texas Instruments MSP430G2432IRSA16T — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430G2432IRSA16T MCU, 16-Bit, 8KB Flash, 16-QFN

MPNMSP430G2432IRSA16T
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Texas Instruments MSP430G2xx series, MSP430G2432IRSA16T, 16-bit MCU, 16MHz, 8KB Flash, 256 x 8 RAM, I²C/SPI/USI, 8x10b ADC, 1.8V-3.6V, -40°C to 85°C, 16-VQFN Exposed Pad.

$3.4100Ref. price · indicative, final on quote
Texas Instruments MSP430G2432IRSA16T datasheet (PDF)
Packaging16-VQFN Exposed Pad
RoHSROHS3 Compliant
SeriesMSP430G2xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430G2432IRSA16T specifications
ParameterValue
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, SPI, USI
Number of i (O)10
Core processorMSP430 CPU16
Case16-VQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size8KB (8K x 8)

Product details

16-bit MSP430 core with 8 KB Flash — what the memory budget means

The 8 KB Flash is enough for a bootloader plus a modest application in battery-monitor or thermostat designs; the 256 B RAM limits stack depth and buffer count, so any design pushing multiple I²C or SPI transactions needs careful allocation.

16-QFN package — footprint and rework notes

Housed in a 16-VQFN with exposed pad (4x4 mm body), this is a surface-mount package that requires a center thermal pad solder paste stencil and a via stitch under the pad for heat dissipation if the MCU runs continuous ADC conversions or PWM output near the maximum supply current. The exposed pad is electrically connected to VSS — the board layout should tie it to the ground plane with multiple vias.

This is a production-grade part suitable for new BOM entries and ongoing manufacturing — no supply-chain urgency beyond normal lead-time management. The ROHS3 compliance is confirmed, which covers the current EU and global regulatory requirements for solder-joint material restrictions.

Frequently asked questions

Is MSP430G2432IRSA16T a drop-in replacement for MSP430G2432IPW20?

No — the IPW20 suffix indicates a 20-pin TSSOP package, while the IRSA16T is a 16-pin QFN. The pin count, footprint, and package type differ, so they are not drop-in compatible. The core, memory, and peripheral features are the same between the two package variants, but a board redesign is required to swap between them.

How do I program MSP430G2432IRSA16T?

Programming is done through the Spy-Bi-Wire (SBW) two-wire JTAG interface, which is standard on all MSP430G2xx devices. TI's MSP430 programmer/debugger tools (e.g., MSP-FET, LaunchPad) support this interface. The internal oscillator allows programming without an external clock source.