MSP430G2432IRSA16R

Texas Instruments

Texas Instruments MSP430G2xx series 16-bit MCU, MSP430G2432IRSA16R, 16 MHz, 8 KB Flash, 256 x 8 RAM, 10 I/O, I²C/SPI/USI, 1.8V-3.6V, -40°C to 85°C, 16-VQFN Exposed Pad.

Texas Instruments MSP430G2432IRSA16R
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

MSP430G2432IRSA16R specifications
Parameter / AttributeSpecification / Value
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, SPI, USI
Number of i (O)10
Core processorMSP430 CPU16
Case16-VQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size8KB (8K x 8)

Technical details

That clock rate is the ceiling for instruction throughput — single-cycle core operations at 16 MHz give you a 62.5 ns instruction cycle, enough for sensor polling loops, simple control logic, and low-rate data processing.

Memory sizing — 8 KB Flash, 256 B RAM

Program memory is 8 KB of Flash (8K x 8), organized for sector erase. The 256 x 8 RAM is the working data space — enough for a few dozen variables, a small buffer, and the stack. If your firmware fits under 6 KB and the data set stays under 200 bytes, you have headroom. Beyond that, the next density step in the G2xx family doubles both Flash and RAM, which is the upgrade path if this part feels tight.

The MSP430 architecture is known for low active and standby current, though the exact numbers depend on clock configuration and peripheral use.

I/O and peripherals — 10 pins, I²C/SPI, 8-channel 10-bit ADC

Ten I/O pins are available on the 16-QFN package. The DMA controller can move data between peripherals and memory without CPU intervention, which helps keep the core asleep longer in low-power applications.

Package and footprint — 16-QFN with exposed pad

The 4x4 mm footprint is compact but the pad pitch is fine — verify the solder-paste stencil aperture against the land pattern recommended in the datasheet.

Suitable for outdoor telecom enclosures, factory-floor sensors, automotive cabin (non-engine-bay) modules, and battery-powered IoT nodes that see seasonal temperature swings.

MSP430G2432IRSA16R
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