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Texas Instruments MSP430G2412IPW20 — Microcontrollers & Processors (MCU / MPU / DSP)

MSP430G2412IPW20 16-bit MCU, 8KB Flash, 16 MHz, 20-TSSOP

MPNMSP430G2412IPW20
Active

Texas Instruments MSP430G2xx series MSP430G2412IPW20, 16-bit MCU, 16MHz, 8KB Flash, 256 x 8 RAM, I²C/SPI/USI, 1.8V-3.6V, -40°C to 85°C, 20-TSSOP.

$3.0800Ref. price · indicative, final on quote
Packaging20-TSSOP (0.173", 4.40mm Width)
RoHSROHS3 Compliant
SeriesMSP430G2xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430G2412IPW20 specifications
ParameterValue
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTube
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, SPI, USI
Number of i (O)16
Core processorMSP430 CPU16
Case20-TSSOP (0.173\", 4.40mm Width)
Program memory size8KB (8K x 8)

Product details

What this MSP430G2412IPW20 brings to a BOM

16 MHz core — timing budget for the firmware

At 16 MHz the CPU16 core executes most instructions in a single clock cycle, so the effective throughput is higher than the raw MHz suggests. That speed, combined with the DMA controller, offloads data transfers from the CPU — useful when servicing I²C or SPI traffic without dropping samples.

8 KB Flash, 256 bytes RAM — sizing the firmware footprint

The 256-byte RAM is the tighter constraint: stack and global variables must fit, so any substantial data buffer or lookup table lives in Flash and is copied to RAM only when needed. Designs that log data or run a command-line interface should budget RAM carefully or move to a higher-density MSP430G2xx variant.

The wide supply range lets this MCU run directly from a single Li-ion cell (3.0 V to 4.2 V) or two alkaline cells (down to 1.8 V). No external regulator is needed for the core, which simplifies the power tree and saves board space. The brown-out detect and POR ensure clean startup and reset as the battery discharges — a reliability advantage for portable instruments and wireless sensors.

20-TSSOP package — footprint and reflow

The 20-pin TSSOP (4.4 mm width) is a compact surface-mount package suited for two-layer PCBs. The 0.65 mm pitch requires a fine-pitch soldering profile, but standard reflow ovens handle it. The supplier device package is 20-TSSOP; the package / case is 20-TSSOP (0.173", 4.40 mm width).

Frequently asked questions

What is the difference between MSP430G2412 and MSP430G2553?

The MSP430G2553 is a higher-density sibling in the same MSP430G2xx family, offering up to 16 KB Flash and 512 bytes RAM versus the 8 KB Flash and 256 bytes RAM of the MSP430G2412. The G2553 also adds a comparator and a larger USI module.

How to program MSP430G2412IPW20?

Programming is done through the Spy-Bi-Wire (SBW) two-wire JTAG interface, compatible with TI's MSP-FET or MSP-EXP430G2 launchpad. The on-chip Flash is programmable in-system via SBW or through a production programmer.