MSP430G2353IN20

Texas Instruments

Texas Instruments MSP430G2353IN20, 16-bit MSP430 CPU16, 16 MHz, 4 KB Flash, 256 x 8 RAM, 16 I/O, 8x10b ADC, I²C/SPI/UART, -40 to 85°C, 20-DIP through-hole.

Texas Instruments MSP430G2353IN20
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Technical specifications

MSP430G2353IN20 specifications
Parameter / AttributeSpecification / Value
SeriesMSP430G2xx
MountingThrough Hole
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTube
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)16
Core processorMSP430 CPU16
Case20-DIP (0.300\", 7.62mm)
Data convertersA/D 8x10b
Program memory size4KB (4K x 8)

Technical details

At 16 MHz the core executes most instructions in one or two cycles.

4 KB Flash and 256 bytes RAM — sizing the firmware envelope

4 KB of Flash is a tight envelope. The 256-byte RAM is the real constraint: keep the stack shallow, avoid large local arrays, and use the Flash for constant tables.

Lifecycle — EOL hot, sourced through independent channels

The MSP430G2353IN20 is flagged as end-of-life hot. That means TI has issued a last-time-buy notice; the part is no longer in volume production through franchised distribution. For new BOM lines or long-life products, this is a red flag — plan for a one-time buy or a pin-compatible migration.

Through-hole 20-DIP — board fit and rework

The 20-pin DIP package (0.300-inch row spacing, 7.62 mm pitch) is a standard through-hole footprint. It mates with a 20-pin DIP socket or solders directly into plated through-holes.

Peripherals and connectivity — what is on the pins

MSP430G2353IN20
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