Texas Instruments MSP430G2xx series, MSP430G2332IPW20R, 16-bit MCU, 16 MHz, 4KB Flash (4K x 8), 256 x 8 RAM, I²C/SPI/USI, 8x10b ADC, 1.8V-3.6V, -40°C to 85°C, 20-TSSOP.
| Parameter | Value |
|---|---|
| Series | MSP430G2xx |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 16MHz |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| RAM size | 256 x 8 |
| Core size | 16-Bit |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| Connectivity | I²C, SPI, USI |
| Number of i (O) | 16 |
| Core processor | MSP430 CPU16 |
| Case | 20-TSSOP (0.173\", 4.40mm Width) |
| Data converters | A/D 8x10b |
| Program memory size | 4KB (4K x 8) |
The MSP430G2332IPW20R: On the peripheral side it carries I²C, SPI, and USI serial connectivity for linking to sensors, EEPROMs, or displays, plus an 8-channel 10-bit ADC for direct analog input.
The 20-TSSOP package has a 0.173" body width and 4.40 mm height.
It is ROHS3 compliant.
Lifecycle status determines if the part can be procured or if redesign is needed.
Volume pricing impacts BOM cost for production buyers.
Immediate availability is critical for rush builds or prototype samples.
Design engineers need pin mapping for PCB layout and connectivity.
Sourcing buyers need drop-in replacements when stock is low or cost is high.
Compliance status is required for regulatory and export documentation.