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Texas Instruments MSP430G2312IRSA16T — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430G2312IRSA16T 16-Bit MCU, 16 MHz, 4 KB Flash, 16-QFN

MPNMSP430G2312IRSA16T
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Texas Instruments MSP430G2xx series, MSP430G2312IRSA16T, 16-Bit Microcontroller, MSP430 CPU16 core, 16MHz, 4KB Flash, 256 x 8 RAM, 10 I/O, I²C, SPI, USI, 1.8V~3.6V, -40°C~85°C, Surface Mount, 16-VQFN Exposed Pad, 16-QFN (4x4).

$2.0600Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

MSP430G2312IRSA16T specifications
ParameterValue
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, SPI, USI
Number of i (O)10
Core processorMSP430 CPU16
Case16-VQFN Exposed Pad
Program memory size4KB (4K x 8)

Product details

16 MHz, 4 KB Flash, 256 B RAM — sizing the MSP430G2312IRSA16T for your BOM

Memory budget — the binding constraint

With 4 KB of Flash and 256 bytes of RAM, the firmware engineer needs to budget tightly. The 4 KB program space fits a modest state machine, a few lookup tables, and the MSP430's peripheral driver library — but leave room for the bootloader and calibration constants. The 256-byte RAM ceiling means stack depth and global variables must be counted, not guessed; a deep call tree or a large DMA buffer will overflow silently. The DMA and PWM peripherals are present, but using them together with a serial protocol may exhaust the RAM allocation.

Package and footprint — 16-QFN with exposed pad

The pad is not just a thermal path — it is also the electrical ground connection for the die. No through-hole variant exists.

Frequently asked questions

What is the closest pin-compatible alternative to MSP430G2312IRSA16T?

Within the MSP430G2xx family, the MSP430G2452 (same 16-QFN footprint, 8 KB Flash, 512 B RAM) is a direct drop-in upgrade if more memory is needed. The base product number MSP430G2312 shares the same pinout across density variants, so a BOM swap requires no PCB change.