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Texas Instruments MSP430G2302IPW14R — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430G2302IPW14R 16-bit MCU, 16 MHz, 4 KB Flash

MPNMSP430G2302IPW14R
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Texas Instruments MSP430G2xx series 16-bit MCU, MSP430G2302IPW14R, 16 MHz, 4 KB Flash, 256 x 8 RAM, 1.8 V to 3.6 V supply, -40°C to 85°C, 14-TSSOP package.

$2.1600Ref. price · indicative, final on quote
Texas Instruments MSP430G2302IPW14R datasheet (PDF)
Packaging14-TSSOP (0.173", 4.40mm Width)
RoHSROHS3 Compliant
SeriesMSP430G2xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430G2302IPW14R specifications
ParameterValue
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, SPI, USI
Number of i (O)10
Core processorMSP430 CPU16
Case14-TSSOP (0.173\", 4.40mm Width)
Program memory size4KB (4K x 8)

Product details

MSP430G2302IPW14R — 16-bit MCU for low-power embedded control

Memory sizing — what 4 KB Flash and 256 B RAM mean for your firmware

With 4 KB of Flash (4K x 8) and 256 bytes of RAM, this MCU targets code footprints under 3 KB, leaving headroom for a small RTOS or a state-machine scheduler. The 256-byte RAM ceiling constrains data buffers — a UART FIFO of 64 bytes plus a few sensor readings will consume half of it. For applications needing larger look-up tables or packet buffers, the next density step in the MSP430G2xx family offers 8 KB Flash and 512 B RAM in the same 14-TSSOP footprint, a direct pin-compatible upgrade path.

Supply range and power rail compatibility

At 1.8 V the 16 MHz core speed is still guaranteed, but the Flash access penalty may require wait states — the MSP430G2xx datasheet provides the timing table. For designs targeting sub-1 µA sleep current, the MSP430 architecture's active and standby modes are well documented; this part includes a brown-out reset that prevents corrupt execution during supply droop.

The 14-TSSOP package (4.40 mm width, 0.173" body) is a surface-mount, fine-pitch small-outline package with 10 general-purpose I/O pins brought out. The pinout is shared across several MSP430G2xx devices, so a layout can accommodate multiple Flash/RAM options without a board spin. The 14-TSSOP footprint is common enough that solder stencil and reflow profiles are well established; no special handling beyond standard MSL precautions is required.

ROHS3 compliance is confirmed. For production BOMs, this part can be specified with confidence in its long-term availability through authorized distribution and independent channels.

Frequently asked questions

Is MSP430G2302IPW14R a direct replacement for MSP430G2302IPW14?

Yes, the MSP430G2302IPW14R is the tape-and-reel packaged variant of the MSP430G2302IPW14 (which ships in tubes). The die, firmware, and electrical specifications are identical. The R suffix only denotes the reel packaging format, so a firmware binary programmed for one works on the other without changes.

What is the 16 MHz speed rating good for in this MCU?

The 16 MHz core clock is the maximum CPU frequency for the MSP430 CPU16. At this speed the device can execute most single-cycle instructions in 62.5 ns, which is adequate for real-time control loops sampling at tens of kilohertz, UART/I²C/SPI communication at standard bit rates, and PWM generation up to several hundred kilohertz.

Can MSP430G2302IPW14R be programmed using the standard MSP430 JTAG or Spy-Bi-Wire interface?

Yes, this device supports the two-wire Spy-Bi-Wire (SBW) debug and programming interface standard on all MSP430G2xx devices. The SBW interface uses the TEST and RST pins, requiring only a simple adapter to connect to a standard MSP430 programmer like the MSP-FET or eZ-FET. Full JTAG (4-wire) is also supported but less commonly used on these small-package parts.