Texas Instruments MSP430G2302IN20, MSP430G2xx series, 16-bit MCU, 16 MHz, 4 KB Flash, 256 x 8 RAM, I²C/SPI/USI, 16 I/O, 1.8V-3.6V, -40°C to 85°C, 20-DIP through-hole, ROHS3 compliant, Active.
| Parameter | Value |
|---|---|
| Series | MSP430G2xx |
| Mounting | Through Hole |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 16MHz |
| Package | Tube |
| RAM size | 256 x 8 |
| Core size | 16-Bit |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| Connectivity | I²C, SPI, USI |
| Number of i (O) | 16 |
| Core processor | MSP430 CPU16 |
| Case | 20-DIP (0.300\", 7.62mm) |
| Program memory size | 4KB (4K x 8) |
The 20-pin DIP package (0.300" body, 7.62 mm pitch) is through-hole, which simplifies hand-assembly, prototyping, and rework — a practical choice for low-to-medium volume production runs or field-serviceable boards where a soldered QFN would be harder to replace.
Yes, it is listed as ROHS3 Compliant.
No pin-compatible second-source or direct equivalent is documented in the available records. The MSP430G2xx family includes other density and package variants, but a drop-in alternate from another manufacturer is not cited.