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Texas Instruments MSP430G2253IRHB32T — Microcontrollers & Processors (MCU / MPU / DSP)

MSP430G2253IRHB32T 16-bit MCU, 16 MHz, 2 KB Flash, 32-VQFN

MPNMSP430G2253IRHB32T
Active

Texas Instruments MSP430G2xx series 16-bit MCU, MSP430G2253IRHB32T, 16 MHz, 2 KB Flash, 256 x 8 RAM, 1.8-3.6 V, -40 to 85 °C, 32-VFQFN exposed pad, 24 I/O, I²C/SPI/UART, A/D 8x10b, internal oscillator.

$2.2100Ref. price · indicative, final on quote
Packaging32-VFQFN Exposed Pad
RoHSROHS3 Compliant
SeriesMSP430G2xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430G2253IRHB32T specifications
ParameterValue
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)24
Core processorMSP430 CPU16
Case32-VFQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size2KB (2K x 8)

Product details

16 MHz, 2 KB Flash, 256 B RAM — the low-power control tier

With 24 general-purpose I/O lines, an 8-channel 10-bit ADC, and serial interfaces including I²C, SPI, and UART, this part covers the typical peripheral set for a low-pin-count mixed-signal controller.

256 bytes of RAM — sizing the stack and buffers

The 256 x 8 RAM allocation is the tightest constraint for firmware. A typical interrupt service routine with a few local variables can consume 20–40 bytes of stack; a UART receive buffer of 64 bytes leaves about 150 bytes for the main loop's working set. This part is not suited for large data arrays, TCP/IP stacks, or multi-level state machines with deep call trees. It fits best in applications where the firmware fits in a few hundred bytes of code and uses register-based or single-buffer I/O.

TI has not issued a last-time-buy notice or end-of-life notification for this device as of the current record.

Package and thermal pad — what the layout sees

The exposed pad also serves as the ground return for the core and I/O — the layout should connect it to the ground plane with multiple vias to keep the inductance low.

Frequently asked questions

Is MSP430G2253IRHB32T obsolete or end-of-life?

No. It remains a current-production device suitable for new designs.

What are the alternative parts to MSP430G2253IRHB32T?

The peer F280041PZQR is a 32-bit C2000 C28x MCU running at 100 MHz with 12-bit ADC and automotive qualification — it targets a different performance and price tier. For a drop-in functional alternative within the MSP430 family, look at higher-density MSP430G2xx variants with more Flash and RAM in the same 32-VQFN footprint, though pin compatibility should be verified per the specific package option.

What is the listed speed (16 MHz) on this component line?

The core processor runs at 16 MHz. At this clock rate the Flash requires zero wait states, so instruction execution is single-cycle for most operations, giving a throughput of about 16 MIPS.