MSP430G2233IPW20R

Texas Instruments

Texas Instruments MSP430G2xx series, MSP430G2233IPW20R, 16-bit MCU, 16 MHz, 2 KB Flash, 256 x 8 RAM, I²C/SPI/UART, 8x10-bit ADC, 1.8 V to 3.6 V, -40°C to 85°C, 20-TSSOP.

Texas Instruments MSP430G2233IPW20R
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

MSP430G2233IPW20R specifications
Parameter / AttributeSpecification / Value
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)16
Core processorMSP430 CPU16
Case20-TSSOP (0.173\", 4.40mm Width)
Data convertersA/D 8x10b
Program memory size2KB (2K x 8)

Technical details

What this 16-bit MCU brings to a control board

It carries 2 KB of program Flash and 256 bytes of RAM — enough for small sensor-to-communication tasks like reading a temperature probe and reporting over I²C or UART.

At 16 MHz the CPU16 can execute a single-cycle multiply in one clock, so a 10-bit ADC read and a UART byte transmit fit inside a 62.5 ns window. That is fast enough for 100 kHz sensor polling loops or a 20 kHz PWM update from the on-chip timer.

2 KB Flash, 256 B RAM — sizing the firmware envelope

With 2 KB of Flash and 256 bytes of RAM, the firmware budget is tight. That is enough for a simple state machine with a few lookup tables, a UART command parser, and an I²C driver for a sensor. It will not hold a real-time operating system or a TCP/IP stack. Plan the code size before committing the BOM — the MSP430G2xx family includes pin-compatible parts with up to 8 KB Flash if the application grows.

The brown-out detect resets the core cleanly when the battery sags below the operating threshold.

20-TSSOP package — board-fit notes

The 20-TSSOP body is 4.4 mm wide with a 0.65 mm pitch — a compact footprint for space-constrained designs. It is a surface-mount package, so reflow soldering is standard. The supplier device package is 20-TSSOP; the package / case is 20-TSSOP (0.173", 4.40 mm Width). No exposed thermal pad, so heat dissipation is through the leads — keep the ambient load within the 85°C ceiling.

MSP430G2233IPW20R
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