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Texas Instruments MSP430G2233IPW20 — Microcontrollers & Processors (MCU / MPU / DSP)

Texas Instruments MSP430G2233IPW20 MCU, 16-bit, 16 MHz

MPNMSP430G2233IPW20
Active

Texas Instruments MSP430G2xx series, MSP430G2233IPW20, 16-bit MCU, 16 MHz, 2 KB Flash, 256 x 8 RAM, 20-TSSOP, -40°C to 85°C, I²C/SPI/UART, 8x10-bit ADC.

$2.0600Ref. price · indicative, final on quote
Packaging20-TSSOP (0.173", 4.40mm Width)
RoHSROHS3 Compliant
SeriesMSP430G2xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430G2233IPW20 specifications
ParameterValue
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTube
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)16
Core processorMSP430 CPU16
Case20-TSSOP (0.173\", 4.40mm Width)
Data convertersA/D 8x10b
Program memory size2KB (2K x 8)

Product details

16 MHz core — timing and power budget

At 16 MHz the MSP430G2233IPW20 delivers enough throughput for real-time sensor polling, basic PID loops, and UART/I²C transaction handling.

Memory sizing — 2 KB Flash, 256 B RAM

With 2 KB of Flash and 256 bytes of RAM, this MCU is sized for small firmware images. The Flash is field-reprogrammable via the internal bootloader or a Spy-Bi-Wire (SBW) debugger.

20-TSSOP package — field-swappable footprint

The 20-TSSOP package (0.173" body width, 4.40 mm) is a standard surface-mount footprint that can be hand-soldered with a fine-tip iron or reworked with hot air. No exposed pad, no tricky thermal management — just 20 pins with 0.65 mm pitch. For field-service swaps, the pin 1 indicator is clearly marked on the package top.

Frequently asked questions

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