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Texas Instruments MSP430G2231IRSA16T — Microcontrollers & Processors (MCU / MPU / DSP)

Texas Instruments MSP430G2231IRSA16T 16-bit MCU, 16 MHz

MPNMSP430G2231IRSA16T
Active

Texas Instruments MSP430G2xx series 16-bit MCU, MSP430G2231IRSA16T, 16 MHz core, 2 KB Flash, 128 B RAM, 10 I/O, 8x10b ADC, I²C/SPI, 1.8 V to 3.6 V, -40°C to 85°C, 16-QFN.

$2.4400Ref. price · indicative, final on quote
Packaging16-VQFN Exposed Pad
RoHSROHS3 Compliant
SeriesMSP430G2xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430G2231IRSA16T specifications
ParameterValue
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size128 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, SPI
Number of i (O)10
Core processorMSP430 CPU16
Case16-VQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size2KB (2K x 8)

Product details

128 bytes RAM — the real constraint

The 128 x 8 RAM is the tightest resource on this MCU. It forces a lean firmware approach — no heavy buffering, no RTOS, no large lookup tables. This part is not for data logging or complex protocol stacks; it is for a single-threaded control task where the code fits in a few hundred bytes and the data lives in registers or Flash constants.

16-QFN with exposed pad — layout notes

The MSP430G2231IRSA16T comes in a 16-VQFN Exposed Pad package (supplier device package 16-QFN, 4x4 mm). The 10 I/O pins are all that is available, so plan the pin allocation early: the ADC inputs share pins with the digital I/O, and the I²C/SPI peripherals are muxed onto specific pins.

Frequently asked questions

Is MSP430G2231IRSA16T compatible with MSP430G2231?

The base product number is MSP430G2231. The IRSA16T suffix indicates the specific package (16-QFN with exposed pad) and tape-and-reel packaging. Functionally, it is the same die in a different package variant.