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Texas Instruments MSP430G2231IRSA16R — Microcontrollers & Processors (MCU / MPU / DSP)

MSP430G2231IRSA16R 16-bit MCU, 16 MHz, 2 KB Flash, 16-QFN

MPNMSP430G2231IRSA16R
Active

Texas Instruments MSP430G2xx series 16-bit MCU, MSP430G2231IRSA16R, 16 MHz, 2 KB Flash, 128 x 8 RAM, I²C/SPI, 10 I/O, 8-ch 10-bit ADC, 1.8V–3.6V, -40°C to 85°C, 16-QFN (4x4 mm).

$2.0900Ref. price · indicative, final on quote
Packaging16-VQFN Exposed Pad
RoHSROHS3 Compliant
SeriesMSP430G2xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430G2231IRSA16R specifications
ParameterValue
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size128 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, SPI
Number of i (O)10
Core processorMSP430 CPU16
Case16-VQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size2KB (2K x 8)

Product details

On-chip peripherals include a 10-bit ADC with 8 channels, I²C and SPI serial interfaces, a PWM timer, and a watchdog timer with brown-out reset. This part is aimed at battery-powered or energy-harvesting applications where every microamp matters — think portable medical monitors, wireless sensor nodes, handheld instruments, and building-automation controllers.

Memory and peripheral budget — what fits

With 2 KB of Flash and 128 bytes of RAM, firmware must be tight. A typical I²C temperature sensor driver with a PID loop and UART debug output fits in about 1.2 KB of Flash, leaving room for a bootloader or calibration table. The 128-byte RAM ceiling means no large data buffers — plan for register-based or EEPROM-emulated storage. The 10-bit ADC resolves 3.3 V to about 3.2 mV per count, adequate for thermistor or potentiometer readout but not for precision load-cell measurements.

Housed in a 16-pin QFN with an exposed thermal pad (4x4 mm body), this package demands a solid ground-plane connection under the pad. The datasheet recommends a 2x2 via array in the pad for thermal transfer — skip the vias and the junction temperature climbs quickly above 85°C ambient at continuous 10 mA I/O loads. All 10 GPIOs are 5 V tolerant on this variant, so level shifting is not needed when interfacing to 5 V logic or sensors.

Frequently asked questions

What is the MSP430G2231IRSA16R equivalent part?

The F280041PZQR from TI's C2000 family is a 32-bit MCU with a different core and package — not a functional equivalent for this MSP430 part.