16 MHz ultra-low-power MCU with 2 KB Flash — fit for battery-edge nodes
Ten general-purpose I/O lines plus I²C, SPI, and USI serial interfaces cover basic sensor readout, actuator control, and board-level communication.
Industrial temperature grade and 16-QFN package
The 16-VQFN package with exposed pad (4x4 mm body) provides a low-profile, thermally enhanced footprint for space-constrained PCBs. Surface-mount assembly with the exposed pad soldered to a ground plane improves heat transfer and reduces junction temperature under continuous load.
The MSP430G2xx series is a mature, widely deployed family with stable supply through franchised and independent channels.
