MSP430G2211IRSA16R

Texas Instruments · MSP430G2xx Series

Texas Instruments MSP430G2xx series, MSP430G2211IRSA16R, 16-bit MCU, 16 MHz, 2 KB Flash, 128 B RAM, 10 I/O, 1.8 V - 3.6 V supply, -40°C to 85°C, 16-QFN.

Texas Instruments MSP430G2211IRSA16R
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MOQ 1 · Tape & Reel (TR) Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

MSP430G2211IRSA16R specifications
Parameter / AttributeSpecification / Value
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed16MHz
PackageTape & Reel (TR) Cut Tape (CT)
RAM size128 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
Number of i (O)10
Core processorMSP430 CPU16
Case16-VQFN Exposed Pad
Program memory size2KB (2K x 8)

Technical details

16 MHz MSP430 core in a 4x4 mm QFN — what you get

2 KB Flash and 128 B RAM — sizing the firmware budget

With 2 KB of Flash and 128 bytes of RAM, this MCU is aimed at small-footprint applications: a few lines of state-machine logic, a temperature or pressure readout, a relay timer, or a simple capacitive-touch button interface. The 16-bit core handles arithmetic efficiently, but the RAM is tight — any data buffer beyond a handful of bytes needs careful budgeting. The Flash is rated for 10k erase/write cycles typical of the MSP430 family, sufficient for calibration constants or configuration settings that change infrequently.

Industrial temperature range — not automotive-qualified

This part is not AEC-Q100 qualified. For automotive applications requiring AEC-Q100, consider the F280041PZQR.

16-QFN package — placement and thermal notes

The 16-QFN package (4x4 mm) is surface-mount with an exposed pad. The pad is electrically connected to the die substrate.

Active product status — no LTB risk

ROHS3 compliance is confirmed. The MSP430G2xx family remains a supported portfolio.

MSP430G2211IRSA16R
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