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Texas Instruments MSP430G2131IN14 — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430G2131IN14 MCU, 16-Bit, 16MHz, 1KB Flash, 14-DIP

MPNMSP430G2131IN14
Active

Texas Instruments MSP430G2xx series 16-bit microcontroller, MSP430G2131IN14, 16MHz, 1KB Flash, 128 x 8 RAM, 14-DIP (0.300", 7.62mm), through-hole.

$2.5900Ref. price · indicative, final on quote
Packaging14-DIP (0.300", 7.62mm)
RoHSROHS3 Compliant
SeriesMSP430G2xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430G2131IN14 specifications
ParameterValue
SeriesMSP430G2xx
MountingThrough Hole
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTube
RAM size128 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, SPI
Number of i (O)10
Core processorMSP430 CPU16
Case14-DIP (0.300\", 7.62mm)
Data convertersA/D 8x10b
Program memory size1KB (1K x 8)

Product details

16 MHz MSP430 core in a through-hole DIP — the firmware budget and the pin count

The MSP430G2131IN14: The 14-pin DIP package (0.300" row spacing) gives you 10 general-purpose I/O lines. That pin count is the hard limit on external connections — every peripheral, sensor interrupt, or LED driver competes for those 10 pins. The internal peripherals (Brown-out Detect/Reset, POR, PWM, WDT) are wired to dedicated pins, so the usable I/O count is effectively 8–10 depending on the oscillator and reset configuration. On-chip data converters include an 8-channel, 10-bit ADC — enough for reading multiple analog sensors (thermistor, potentiometer, current shunt) without an external mux.

The internal oscillator is trimmed to ±1% accuracy at 25°C, which is sufficient for UART communication at 9600 baud without an external resonator. For applications that need tighter timing (e.g., I²C at 400 kHz), the clock source can be switched to an external crystal on the XIN/XOUT pins, though that consumes two of the 10 I/O lines.

Active lifecycle and through-hole availability

The 14-pin DIP package is a through-hole form factor — it breadboard-prototypes easily and is preferred for low-volume production or field-repairable assemblies where a socket is used. The same die is also available in a surface-mount TSSOP-14 package as the MSP430G2132IPW14R, which shares the same 1 KB Flash, 128 B RAM, and 10-bit ADC but uses a different pinout (the TSSOP adds a VREF+ pin).

Frequently asked questions

What is the memory footprint of the MSP430G2131IN14?

The device has 1 KB of Flash program memory (1K x 8) and 128 bytes of RAM. The Flash is sufficient for small control loops, sensor calibration tables, or a single communication protocol stack. The 128-byte RAM limits the stack depth and buffer size — a UART receive buffer larger than 64 bytes will consume half the available RAM.

Can the MSP430G2131IN14 replace the MSP430G2132IPW14R in a design?

The MSP430G2131IN14 and MSP430G2132IPW14R share the same MSP430 CPU16 core, 16 MHz clock, 1 KB Flash, 128 B RAM, and 10-bit ADC. However, the MSP430G2131IN14 is in a 14-pin DIP package (through-hole), while the MSP430G2132IPW14R is a TSSOP-14 surface-mount package. The pinouts differ — the TSSOP variant adds a dedicated VREF+ pin. A board designed for the DIP footprint cannot accept the TSSOP package without a redesign.