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Texas Instruments MSP430G2001IRSA16R — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430G2001IRSA16R 16-bit MCU, 16 MHz, 512B Flash

MPNMSP430G2001IRSA16R
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Texas Instruments MSP430G2001IRSA16R, 16-bit MSP430 CPU16, 16 MHz, 512B (512 x 8) FLASH, 128 x 8 RAM, 10 I/O, 1.8V ~ 3.6V, -40°C ~ 85°C, 16-VQFN Exposed Pad, 16-QFN (4x4), Tape & Reel.

$0.6972Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

MSP430G2001IRSA16R specifications
ParameterValue
SeriesMSP430G2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size128 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
Number of i (O)10
Core processorMSP430 CPU16
Case16-VQFN Exposed Pad
Program memory size512B (512 x 8)

Product details

What this 16-bit MCU brings to a low-power BOM

The 10 general-purpose I/O pins, internal oscillator, and on-chip peripherals (brown-out detect, POR, PWM, WDT) let it replace a handful of discrete logic or a small 8-bit MCU in a power-constrained design.

512 bytes Flash, 128 bytes RAM — sizing the firmware budget

The 512-byte Flash and 128-byte RAM are the hard constraints that define whether this part fits your application. The Flash holds the compiled firmware image; a typical MSP430G2xx interrupt vector table and startup code consumes about 32 to 64 bytes, leaving roughly 450 bytes for the application loop, peripheral initialization, and any lookup tables. The 128-byte RAM must cover stack, global variables, and interrupt context — a single 64-byte buffer eats half the budget. If your firmware fits within these limits, the MSP430G2001IRSA16R delivers the lowest active power in the MSP430G2xx lineup, with a typical active-mode draw around 220 µA at 1 MHz and 2.2 V. For designs that need more headroom, the MSP430G2x13 or G2x53 siblings offer 1 KB to 8 KB Flash and 128 to 512 bytes RAM in the same 16-QFN footprint.

Package and mounting: 16-QFN with exposed pad

The part comes in a 16-VQFN Exposed Pad package (supplier device package 16-QFN, 4x4 mm). The QFN footprint is compact, but the 0.5 mm pitch and the center pad require a stencil with good paste coverage to avoid voids.

Frequently asked questions

Is MSP430G2001IRSA16R a good replacement for MSP430G2001IPW?

The MSP430G2001IPW is the TSSOP-16 package variant of the same die. They are electrically identical — same core, memory, peripherals, and supply range — but the footprint and thermal behavior differ. The QFN version offers a smaller PCB area and better thermal dissipation through the pad, but requires a different land pattern and stencil design. If your board layout can accommodate either package, the IRSA16R is a drop-in functional replacement for the IPW after adjusting the footprint.