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Texas Instruments MSP430FR5724IPWR — Microcontrollers & Processors (MCU / MPU / DSP)

MSP430FR5724IPWR 16-bit MCU, 8KB FRAM, 8MHz, 28-TSSOP

MPNMSP430FR5724IPWR
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Texas Instruments MSP430FR5724IPWR, 16-bit MSP430 CPUXV2 MCU, 8KB FRAM, 1K x 8 RAM, 8MHz, 21 I/O, I²C/SPI/UART, 10x10b ADC, 2V-3.6V, -40°C to 85°C, 28-TSSOP.

$1.7700Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
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  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

MSP430FR5724IPWR Technical Specifications
ParameterValue
SeriesMSP430™ FRAM
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFRAM
Voltage - supply (Vcc (Vdd))2V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed8MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size1K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)21
Core processorMSP430 CPUXV2
Case28-TSSOP (0.173\", 4.40mm Width)
Data convertersA/D 10x10b
Program memory size8KB (8K x 8)

Product details

FRAM MCU for low-power sensing and control

It integrates 8 KB of FRAM program memory — a non-volatile storage technology that writes at near-SRAM speed with essentially unlimited endurance — plus 1K x 8 of RAM. The 21 general-purpose I/O lines in a 28-TSSOP package give a compact footprint for space-constrained boards.

Lifecycle and sourcing posture

For dual-sourcing planning, the MSP430 FRAM family includes several pin-compatible density options — the MSP430FR5724IRHBR in a 32-VQFN package is a common cross-shop candidate when board area or thermal performance drives the package choice.

Frequently asked questions

What is the difference between MSP430FR5724IPWR and MSP430FR5724IRHBR?

The two parts share the same core, memory (8 KB FRAM, 1K x 8 RAM), peripherals, and temperature range. The difference is the package: the IPWR comes in a 28-TSSOP, while the IRHBR is in a 32-VQFN. The VQFN offers a smaller footprint and better thermal dissipation, but requires a different PCB layout.