MSP430FR2632IRGER

Texas Instruments · MSP430™ FRAM Series

Texas Instruments MSP430FR2632IRGER, 16-bit MSP430 CPU16 MCU, 16 MHz, 8.5 KB FRAM, 2K x 8 RAM, 15 I/O, 1.8V–3.6V, 24-VQFN (4x4), -40°C to 85°C.

Texas Instruments MSP430FR2632IRGER
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Technical specifications

MSP430FR2632IRGER specifications
Parameter / AttributeSpecification / Value
SeriesMSP430™ FRAM
MountingSurface Mount
Oscillator typeInternal
Program memory typeFRAM
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed16MHz
PackageTape & Reel (TR) Cut Tape (CT)
RAM size2K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI2C, IrDA, SCI, SPI, UART/USART
Number of i (O)15
Core processorMSP430 CPU16
Case24-VFQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size8.5KB (8.5K x 8)

Technical details

16 MHz MSP430 CPU16 with 8.5 KB FRAM — the non-volatile memory that writes like RAM

Alongside that sits 2K x 8 of SRAM for stack and scratchpad.

15 I/O, I²C/SPI/UART, 8-channel 10-bit ADC — peripheral set for sensor and control loops

The integrated 8-channel 10-bit ADC samples analog signals directly, saving an external converter. Internal oscillator means you can run without a crystal for many applications, though the internal RC is accurate enough for UART timing at common baud rates.

24-VQFN (4x4) with exposed pad — layout and rework notes

That pad needs a via array to the ground plane to pull heat out of the die — without it, the junction temperature climbs faster under continuous load. For rework, the QFN profile is standard: preheat the board to 150°C, hot-air nozzle over the package, and tweezers lift once the solder flows. Surface-mount only, no through-hole variant.

MSP430FR2632IRGER
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