FRAM memory: why it changes the BOM equation
For a design that logs configuration data or needs frequent non-volatile updates, this eliminates the separate EEPROM or battery-backed SRAM that a Flash MCU would require.
Supply voltage and temperature — what they let you do
The 40-VFQFN exposed-pad package (6x6 mm) aids thermal dissipation in enclosed designs.
Peripherals and I/O — what connects where
For a control board that needs analog front-end and serial interfaces in one package, this MCU consolidates several discrete components.
