MSP430FR2353TRSMT

Texas Instruments · MSP430™ FRAM Series

Texas Instruments MSP430™ FRAM series, MSP430FR2353TRSMT, 16-bit MCU, 24 MHz, 16 KB FRAM, 2K x 8 RAM, 28 I/O, I²C/SPI/UART, 8x12b ADC, 1.8V–3.6V, -40°C to 105°C, 32-VQFN (4x4 mm).

Texas Instruments MSP430FR2353TRSMT
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Technical specifications

MSP430FR2353TRSMT specifications
Parameter / AttributeSpecification / Value
SeriesMSP430™ FRAM
MountingSurface Mount
Oscillator typeInternal
Program memory typeFRAM
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed24MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size2K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, IrDA, SPI, UART/USART
Number of i (O)28
Core processorMSP430 CPU16
Case32-VFQFN Exposed Pad
Data convertersA/D 8x12b SAR
Program memory size16KB (16K x 8)

Technical details

Packaged in a 32-VQFN (4x4 mm) with 28 I/O lines, it integrates an 8-channel 12-bit SAR ADC, internal oscillator, and serial interfaces including I²C, SPI, and UART.

FRAM endurance — no wear-leveling tax on the firmware

Unlike Flash-based MCUs where a 100k-cycle sector limit forces wear-leveling in the OTA staging area, FRAM handles write-after-write without erase cycles. For a data-logging endpoint that stores a 16-byte record every minute, the 16 KB FRAM outlives the product's service life without a dedicated filesystem layer.

Package and footprint — 32-VQFN rework notes

The 32-VQFN (4x4 mm) with exposed pad needs a stencil aperture that covers the thermal pad — a common rework miss is under-printing the pad, which lifts the die temperature 15°C above the junction limit at 105°C ambient.

MSP430FR2353TRSMT
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