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Texas Instruments MSP430F67461IPZ — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430F67461IPZ 16-bit MCU, 25MHz, 256KB Flash

MPNMSP430F67461IPZ
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Texas Instruments MSP430F6xx series 16-bit MCU, MSP430F67461IPZ, core MSP430 CPUXV2 at 25MHz, 256KB Flash, 16K x 8 RAM, 4x24b Sigma Delta Converter, 62 I/O, I²C/SPI/UART/IrDA/LIN, 100-LQFP, -40°C to 85°C.

$10.4066Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MSP430F67461IPZ Technical Specifications
ParameterValue
SeriesMSP430F6xx
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed25MHz
PackageTray
RAM size16K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, LCD, POR, PWM, WDT, 4x24b Sigma Delta Converter
ConnectivityI²C, IrDA, LINbus, SPI, UART/USART
Number of i (O)62
Core processorMSP430 CPUXV2
Case100-LQFP
Data convertersA/D 8x10b
Program memory size256KB (256K x 8)

Product details

What the 4x24-bit sigma-delta ADC means for your BOM

The MSP430F67461IPZ: What sets this part apart from the broader MSP430 family is the integrated set of four 24-bit sigma-delta ADCs, making it a targeted choice for polyphase energy metering, precision instrumentation, and industrial sensor conditioning where multiple high-resolution analog channels are needed without external converter ICs. The 256KB of Flash program memory and 16K x 8 of RAM provide enough headroom for complex metering algorithms, communication stacks (I²C, SPI, UART, IrDA, LINbus), and LCD drive firmware without external memory.

100-LQFP package — rework and layout notes

Housed in a 100-LQFP (14x14mm) package, the MSP430F67461IPZ is a surface-mount part with 62 I/O brought out to fine-pitch leads. The 0.5mm pitch demands careful solder paste stencil design and a reflow profile that avoids tombstoning on the smaller perimeter pads. Will it survive the hot air? Yes — the LQFP is one of the most rework-friendly packages in production; a hot-air station with a shaped nozzle lifts the part cleanly without cooking adjacent passives, provided the board is preheated to 100°C to reduce thermal shock.

Lifecycle and supply posture

This is a standard-channel part suitable for qualification into new designs without near-term LTB risk.

Frequently asked questions

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