Active production — no last-time-buy risk
The MSP430F6632IPZ: New designs can commit to this part without a last-time-buy window.
256 KB flash and 18 KB RAM — the memory budget for a mixed-signal MCU
256 KB of on-chip flash holds the application firmware plus a bootloader; 18 KB of SRAM covers the stack, DMA buffers, and USB endpoint data. The 20 MHz CPUXV2 core executes from flash with zero-wait-state up to 8 MHz — above that the flash wait state controller inserts one cycle per access, so time-critical loops should run from RAM or use the hardware multiplier.
Peripheral set — USB, serial buses, and PWM for sensor-to-cloud gateways
The MSP430F6632IPZ integrates a USB 2.0 full-speed module with an on-chip PHY — no external transceiver needed for USB-to-serial bridges or data loggers. Additional connectivity includes I2C, SPI, UART/USART, LIN, and IrDA, covering the common sensor and actuator bus protocols in a factory automation node. On-chip DMA moves data between peripherals and memory without CPU intervention — useful for streaming ADC samples or USB packets while the core handles protocol parsing. The PWM timer drives LED dimming or motor control loops directly from the timer output pins.
Industrial temperature grade and 100-LQFP package
The 100-pin LQFP (14x14 mm body) is a standard fine-pitch package with 0.5 mm lead pitch; the exposed pad on the underside provides a low-thermal-resistance path to the PCB copper pour. Surface-mount assembly per JEDEC MSL-3 (implied by the LQFP package) — the moisture-sensitive label on the reel dictates bake time before reflow if the floor life has been exceeded.