113-ball BGA — what the footprint demands
That 0.5 mm pitch BGA means the PCB needs via-in-pad or microvias for breakout; the four inner rows are not fan-out friendly on a two-layer board. Plan for at least four layers if you route all 74 I/O.
USB on board — peripheral set at a glance
The DMA controller offloads the CPU for USB bulk transfers. Brown-out detect, POR, PWM, and WDT round out the on-chip peripherals. The 74 I/O count, in a 113-ball BGA, means many pins are power or ground — check the pin map before committing the layout.
TI no longer manufactures this specific BGA variant. The remaining stock in distribution is last-time-buy inventory or surplus from the independent channel. For a production BOM, you will need to qualify a replacement. No official TI successor with the exact 113-BGA footprint is listed; the MSP430F5xx series includes other Flash/RAM density options in QFP packages that may require a PCB re-spin.