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Texas Instruments MSP430F5335IZCAT — Microcontrollers & Processors (MCU / MPU / DSP)

MSP430F5335IZCAT 16-bit MCU, 20 MHz, 256 KB Flash, 113-NFBGA

MPNMSP430F5335IZCAT
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Texas Instruments MSP430F5xx series 16-bit MCU, MSP430 CPUXV2 core, 20 MHz, 256 KB Flash, 18 KB RAM, 74 I/O, 113-VFBGA package, -40°C to 85°C.

$7.1666Ref. price · indicative, final on quote
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MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
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  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

MSP430F5335IZCAT Technical Specifications
ParameterValue
SeriesMSP430F5xx
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed20MHz
PackageTape & Reel (TR)
RAM size18K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)74
Core processorMSP430 CPUXV2
Case113-VFBGA
Data convertersA/D 16x12b
Program memory size256KB (256K x 8)

Product details

What this 16-bit MCU brings to the board

The Texas Instruments MSP430F5335IZCAT is a 16-bit microcontroller from the MSP430F5xx family, built around the core running at 20 MHz. It carries 256 KB of program Flash and 18 KB of RAM, enough for moderate firmware stacks and real-time data buffering in embedded control applications. The 74 general-purpose I/O lines and integrated 12-bit ADC with 16 channels reduce the need for external peripherals on sensor-heavy designs. Connectivity covers I²C, SPI, UART/USART, IrDA, and LINbus, plus an internal oscillator that saves a crystal on the BOM. The peripheral set includes a brown-out detect, POR, PWM, and a watchdog timer — standard for industrial control firmware that needs supervised startup and fault recovery. The operating temperature range of -40°C to 85°C qualifies it for factory automation, outdoor telecom cabinets, and other environments where the board sees seasonal temperature swings without active cooling.

Lifecycle and sourcing reality

Package and mounting

Housed in a 113-ball NFBGA (7x7 mm) package, this is a surface-mount device intended for reflow soldering. The fine-pitch BGA footprint requires careful PCB layout and X-ray inspection post-assembly — not a hand-solder part. The 74 I/O lines are distributed across the ball grid, so fan-out via micro-vias or blind vias is typical on a four-layer board.

Frequently asked questions

Is MSP430F5335IZCAT obsolete or nearing end of life?

Yes, this part is end-of-life (EOL) per the lifecycle record. Production has ceased, and remaining units are available only through surplus and independent distribution channels. Plan for a replacement or last-time-buy now.

What is the datasheet for MSP430F5335IZCAT?

The datasheet is published by Texas Instruments under the base product number MSP430F5335. It covers the full MSP430F5xx family electrical characteristics, memory map, peripheral registers, and application notes. We do not host the PDF here, but it is available from the manufacturer's website.

What is MSP430F5335IZCAT's listed speed (20 MHz) on this component line?

The core processor runs at 20 MHz, which translates to roughly 20 MIPS on the MSP430 CPUXV2 architecture. That is the maximum clock; the device can be clocked lower to save power, with the internal oscillator or an external crystal.