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Texas Instruments MSP430F5329IPNR — Microcontrollers & Processors (MCU / MPU / DSP)

MSP430F5329IPNR 16-bit MCU, 25 MHz, 128 KB Flash, 80-LQFP

MPNMSP430F5329IPNR
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Texas Instruments MSP430F5xx series, 16-bit MSP430 CPUXV2 microcontroller, MSP430F5329IPNR, 25 MHz, 128 KB FLASH, 10 KB RAM, 63 I/O, 1.8–3.6 V, 80-LQFP, -40 to 85°C.

$8.0200Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430F5329IPNR specifications
ParameterValue
SeriesMSP430F5xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed25MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size10K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)63
Core processorMSP430 CPUXV2
Case80-LQFP
Data convertersA/D 16x12b
Program memory size128KB (128K x 8)

Product details

Core and memory — what the 25 MHz CPUXV2 and 128 KB flash mean for BOM fit

The MSP430F5329IPNR runs the 16-bit MSP430 CPUXV2 core at 25 MHz — the throughput ceiling is set by the flash wait-state profile at that clock, not the core itself. 128 KB of on-chip flash (128K x 8) and 10 KB of RAM (10K x 8) give the firmware and data buffer budget for a mid-range mixed-signal design: a sensor hub logging ADC readings over I²C while running a PWM output loop, for example, fits without external memory.

Peripherals and connectivity — what is on the die and what it drives

63 I/O lines in the 80-LQFP package — enough to drive a character LCD, read a keypad matrix, and still leave spare GPIO for status LEDs and a serial debug header.

Supply and temperature — board integration and environment

The internal oscillator eliminates the external crystal for basic timing, though an external clock source can be fed in for tighter accuracy in USB or CAN applications. This covers factory-floor enclosures, outdoor telecom cabinets, and engine-bay-adjacent electronics that see 85°C ambient but not the under-hood 125°C of AEC-Q100 Grade 0 parts. The 80-LQFP package (12x12 mm body, 0.5 mm pitch) requires a 4-layer PCB for reliable fan-out of the inner rows — two-layer boards will struggle to route all 63 I/O plus the supply and ground pins without via-in-pad or blind vias.

Frequently asked questions

What is MSP430F5329IPNR's core speed and memory configuration?

The CPUXV2 core runs at 25 MHz, with 128 KB of on-chip flash program memory and 10 KB of RAM. This combination handles firmware for sensor fusion, motor control, or communication protocol stacks without external memory.

What package does MSP430F5329IPNR come in and what are the layout implications?

A 4-layer PCB is recommended for reliable fan-out of the 63 I/O lines plus supply and ground pins.