MSP430F5328IZXH

Texas Instruments · MSP430F5xx Series

Texas Instruments MSP430F5xx series, 16-bit MCU, MSP430F5328IZXH, 25 MHz, 128 KB Flash, 10 KB RAM, 80-NFBGA (5x5), -40 to +85 °C.

Texas Instruments MSP430F5328IZXH
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Technical specifications

MSP430F5328IZXH specifications
Parameter / AttributeSpecification / Value
SeriesMSP430F5xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed25MHz
PackageTray
RAM size10K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)47
Core processorMSP430 CPUXV2
Case80-VFBGA
Data convertersA/D 12x12b SAR
Program memory size128KB (128K x 8)

Technical details

128 KB flash, 10 KB RAM — the real memory envelope

The MSP430F5328IZXH carries 128 KB of program flash (128K x 8) and 10 KB of SRAM. The 16-bit MSP430 CPUXV2 core runs at 25 MHz, but the flash controller inserts wait states above ~8 MHz — the actual instruction throughput is gated by the bus, not the core clock. For a firmware engineer stepping through the boot ROM: the flash prefetch buffer helps, but tight loops with branch-heavy code will stall. The 10 KB RAM split is shared between the stack, heap, and DMA buffers. If your application uses the 12-channel 12-bit SAR ADC for continuous scanning, budget at least 2 KB for the DMA ping-pong buffers alone. The remaining 8 KB must hold the RTOS kernel objects, task stacks, and any large data structures — tight for a TCP/IP stack or GUI framebuffer.

80-NFBGA (5x5) — board layout demands

The 80-NFBGA package measures 5x5 mm with a 0.50 mm ball pitch. This is not a two-layer breakout part — the inner rows of balls require at least a four-layer stack with microvias or blind vias to escape the BGA footprint. The supplier device package is 80-NFBGA (5x5), and the mounting type is surface mount only. If the reflow profile exceeds the floor life, a pre-bake at 125 °C for 48 hours is standard practice before rework. The tray packaging means the parts arrive in a single matrix — no reel, so pick-and-place requires a tray feeder or a bulk-tube adapter.

Industrial temperature and supply voltage envelope

The brown-out detect/reset (BOD) and POR circuits are integrated peripherals — no external supervisor needed for basic power-fail handling. The DMA controller offloads the CPU for ADC data transfers and memory-to-memory moves, which matters when the core is busy servicing the UART/USART or SPI interrupts.

Active production — sourcing posture

The base product number is MSP430F5328, and the series is MSP430F5xx. If a pin-compatible alternative is needed for a second-source hedge, TI's own MSP430F5xx family includes devices with different flash/RAM splits in the same 80-NFBGA footprint — but no official cross-reference is recorded here. Confirm the specific memory and peripheral requirements before substituting.

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