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Texas Instruments MSP430F5328IZXH — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430F5328IZXH MCU, 25 MHz, 128 KB Flash, 80-NFBGA

MPNMSP430F5328IZXH
Active

Texas Instruments MSP430F5xx series, 16-bit MCU, MSP430F5328IZXH, 25 MHz, 128 KB Flash, 10 KB RAM, 80-NFBGA (5x5), -40 to +85 °C.

$8.1000Ref. price · indicative, final on quote
Packaging80-VFBGA
RoHSNot applicable
SeriesMSP430F5xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430F5328IZXH specifications
ParameterValue
SeriesMSP430F5xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed25MHz
PackageTray
RAM size10K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)47
Core processorMSP430 CPUXV2
Case80-VFBGA
Data convertersA/D 12x12b SAR
Program memory size128KB (128K x 8)

Product details

128 KB flash, 10 KB RAM — the real memory envelope

The MSP430F5328IZXH carries 128 KB of program flash (128K x 8) and 10 KB of SRAM. The 16-bit MSP430 CPUXV2 core runs at 25 MHz, but the flash controller inserts wait states above ~8 MHz — the actual instruction throughput is gated by the bus, not the core clock. For a firmware engineer stepping through the boot ROM: the flash prefetch buffer helps, but tight loops with branch-heavy code will stall. The 10 KB RAM split is shared between the stack, heap, and DMA buffers. If your application uses the 12-channel 12-bit SAR ADC for continuous scanning, budget at least 2 KB for the DMA ping-pong buffers alone. The remaining 8 KB must hold the RTOS kernel objects, task stacks, and any large data structures — tight for a TCP/IP stack or GUI framebuffer.

80-NFBGA (5x5) — board layout demands

The 80-NFBGA package measures 5x5 mm with a 0.50 mm ball pitch. This is not a two-layer breakout part — the inner rows of balls require at least a four-layer stack with microvias or blind vias to escape the BGA footprint. The supplier device package is 80-NFBGA (5x5), and the mounting type is surface mount only. If the reflow profile exceeds the floor life, a pre-bake at 125 °C for 48 hours is standard practice before rework. The tray packaging means the parts arrive in a single matrix — no reel, so pick-and-place requires a tray feeder or a bulk-tube adapter.

Industrial temperature and supply voltage envelope

The brown-out detect/reset (BOD) and POR circuits are integrated peripherals — no external supervisor needed for basic power-fail handling. The DMA controller offloads the CPU for ADC data transfers and memory-to-memory moves, which matters when the core is busy servicing the UART/USART or SPI interrupts.

Active production — sourcing posture

The base product number is MSP430F5328, and the series is MSP430F5xx. If a pin-compatible alternative is needed for a second-source hedge, TI's own MSP430F5xx family includes devices with different flash/RAM splits in the same 80-NFBGA footprint — but no official cross-reference is recorded here. Confirm the specific memory and peripheral requirements before substituting.

Frequently asked questions

What is the MSP430F5328IZXH's flash and RAM size?

It has 128 KB of program flash (128K x 8) and 10 KB of SRAM (10K x 8). The 10 KB RAM must hold the stack, DMA buffers, and application data — budget carefully for any RTOS or large data arrays.

What package does the MSP430F5328IZXH use?

It comes in an 80-NFBGA package measuring 5x5 mm with a 0.50 mm ball pitch. This requires a four-layer PCB for fan-out — not a two-layer breakout design.