Package and rework — 64-VFQFN exposed pad
That pad needs a proper via-stitched land pattern under it to pull heat into the board ground plane — without it, continuous operation above 85°C ambient will push the junction temperature.
The base product number is MSP430F5328, so PCN and EOL notifications track under that root. RoHS compliance is standard for TI's current VQFN packages, though the specific certificate should be confirmed at order time.
