Skip to main content
Texas Instruments MSP430F5254IZQE — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430F5254IZQE 16-bit MCU, 25 MHz, 128 KB Flash, 80-BGA

MPNMSP430F5254IZQE
Obsolete

Texas Instruments MSP430F5xx MSP430F5254IZQE, 16-Bit MCU, MSP430 CPUXV2 core, 25 MHz, 128 KB Flash, 32K x 8 RAM, 53 I/O, I²C/SPI/UART, 1.8V–3.6V, -40°C to 85°C, 80-BGA MICROSTAR JUNIOR (5x5).

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

MSP430F5254IZQE specifications
ParameterValue
SeriesMSP430F5xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed25MHz
PackageTape & Reel (TR)
RAM size32K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)53
Core processorMSP430 CPUXV2
Case80-VFBGA
Program memory size128KB (128K x 8)

Product details

TI has discontinued this 80-BGA variant of the MSP430F5xx family. There is no official direct-replacement order code listed in the lifecycle record.

25 MHz MSP430 CPUXV2 — what it buys you

The core runs at 25 MHz, which is the mid-range speed tier for the MSP430F5xx family. At this clock the CPUXV2 16-bit RISC core can sustain around 25 MIPS from internal Flash with one wait state. The 128 KB program memory (128K x 8) and 32K x 8 RAM give enough room for a moderate sensor-fusion or control loop with a small RTOS or TI's MSP430 driverlib. The 53 I/O lines are brought out to the 80-ball BGA — enough for a parallel LCD data bus plus a handful of GPIO for keypad and status LEDs.

80-BGA MICROSTAR JUNIOR — layout and assembly notes

The package is an 80-ball BGA on a 5x5 mm substrate (MICROSTAR JUNIOR). Ball pitch is 0.5 mm nominal — that drives a minimum of four PCB layers for fanout and a controlled-impedance stack if any of the high-speed peripherals (SPI, UART) run near the 25 MHz core clock. No exposed thermal pad — all dissipation is through the BGA balls into the board copper.

Frequently asked questions

What is the direct replacement for MSP430F5254IZQE?

Design engineers and sourcing buyers need a drop-in replacement to avoid redesign when the original part is obsolete.

Is MSP430F5254IZQE in stock?

Availability status directly impacts whether a buyer can order now or must seek alternatives immediately.

What is the price of MSP430F5254IZQE?

Pricing affects budget decisions and BOM cost estimation, especially for high-volume projects.

Can MSP430F5254IZQE be used in new designs?

Lifecycle status determines whether the part is suitable for new product development; obsolete parts may lead to future supply risks.

Where to buy MSP430F5254IZQE?

Buyers need trusted authorized sources to ensure genuine parts and avoid counterfeit risks.

What are the alternatives to MSP430F5254IZQE?

When the original is unavailable or obsolete, engineers and procurement need functionally equivalent options to maintain designs.