MSP430F4250IDL

Texas Instruments

Texas Instruments MSP430x4xx series, MSP430F4250IDL, 16-Bit MCU, 8MHz, 16KB (16K x 8 + 256B) FLASH, 256 x 8 RAM, 32 I/O, 48-SSOP, -40°C to 85°C.

Texas Instruments MSP430F4250IDL
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Technical specifications

MSP430F4250IDL specifications
Parameter / AttributeSpecification / Value
SeriesMSP430x4xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed8MHz
PackageTube
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, LCD, POR, PWM, WDT
Number of i (O)32
Core processorMSP430 CPU16
Case48-BSSOP (0.295\", 7.50mm Width)
Data convertersA/D 1x16b; D/A 1x12b
Program memory size16KB (16K x 8 + 256B)

Technical details

What this MSP430F4250IDL brings to a mixed-signal control board

What sets this part apart for instrumentation and metering designs is the on-chip 16-bit ADC and a 12-bit DAC, letting you handle sensor front-end and analog output generation without external converters.

Integrated ADC and DAC — what it means for signal-chain BOM

The 16-bit ADC and 12-bit DAC are the headline analog features. The ADC resolution (16-bit) gives you enough dynamic range for load-cell, thermocouple, or pressure-sensor conditioning without an external sigma-delta converter. The 12-bit DAC can drive an analog output for valve control or set-point generation. For a calibration technician, the question is long-term drift of the internal reference — TI's MSP430 reference voltage is trimmed, but if your measurement loop demands traceable accuracy over years, you will want to budget an external voltage reference and route it to the ADC's reference input. The DAC output is unbuffered, so plan on an external op-amp if you need to drive a 50-ohm or heavier load.

Package and footprint notes for the layout engineer

It is a surface-mount, gull-wing lead form — standard reflow profile, no exposed thermal pad to stitch. The 32 I/O lines include the LCD segment drive and the ADC/DAC analog pins. Supply decoupling should follow the usual 0.1 µF ceramic per Vcc pin plus a bulk 4.7 µF on the board.

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