Texas Instruments has marked the MSP430F2618TZQW as obsolete.
113-BGA Microstar Junior — rework considerations
The 113-VFBGA package (7x7 mm Microstar Junior) has a 0.50 mm ball pitch — the tightest in the MSP430F2xx BGA family. A 4-layer board with microvias is the practical minimum for fan-out; two-layer boards will not route the inner rows.
On-chip memory and data converters
The flash is organised for field firmware updates — sector erase times are typical for the MSP430 architecture, so budget the erase window into any bootloader routine. Integrated data converters: an 8-channel 12-bit ADC and a 2-channel 12-bit DAC. The ADC samples at up to 200 ksps in the MSP430F2xx family; the DAC settles within 5 µs typical, suitable for control-loop setpoint generation without an external converter.
Connectivity and peripherals for mixed-signal control
On-chip peripherals include a brown-out detect/reset, DMA controller, POR, PWM timer, and watchdog timer. The DMA moves ADC results to memory without CPU intervention — useful for continuous data logging at the 16 MHz core speed.