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Texas Instruments MSP430F2618TPM — Microcontrollers & Processors (MCU / MPU / DSP)

MSP430F2618TPM TI MCU, 16-bit, 16 MHz, 116 KB Flash, 64-LQFP

MPNMSP430F2618TPM
Active

Texas Instruments MSP430F2xx series 16-bit MCU, MSP430F2618TPM, 16 MHz, 116 KB Flash, 8 KB RAM, 48 I/O, 64-LQFP, -40 to +105°C.

$22.3200Ref. price · indicative, final on quote
Packaging64-LQFP
RoHSROHS3 Compliant
SeriesMSP430F2xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430F2618TPM specifications
ParameterValue
SeriesMSP430F2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed16MHz
PackageTray
RAM size8K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)48
Core processorMSP430 CPU16
Case64-LQFP
Data convertersA/D 8x12b; D/A 2x12b
Program memory size116KB (116K x 8 + 256B)

Product details

116 KB flash, 8 KB RAM — memory budget for mixed-signal control

The MSP430F2618TPM packs 116 KB of program flash and 8 KB of RAM on a 16-bit CPU16 core clocked at 16 MHz. That memory split suits a single-chip controller that runs a sensor-fusion algorithm, a Modbus stack, and a PID loop without needing external memory — the 8 KB RAM holds a few hundred data points for a 1 kHz logging rate. On-chip data converters — an 8-channel 12-bit ADC and a dual 12-bit DAC — let it close the analog loop directly: read a current shunt or thermistor, compute the correction, and drive an actuator output without an external converter. The 48 general-purpose I/O lines, combined with I²C, SPI, UART, IrDA, and LIN connectivity, cover sensor buses, debug UART, and automotive LIN node interfaces on a single part.

The internal oscillator and brown-out detect (BOD) keep the core running through supply dips down to the reset threshold.

Package and board-fit note — 64-LQFP

Housed in a 64-LQFP with a 10x10 mm body and 0.50 mm pitch. Surface-mount only — no through-hole variant. The fine pitch demands controlled solder-paste deposition and a reflow profile matching JEDEC MSL level (not listed, but typical for this package class).

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