Texas Instruments MSP430F2xx series 16-bit MCU, MSP430F2616TZCAR, 16MHz, 92KB Flash, 4K x 8 RAM, 64 I/O, 1.8V-3.6V, -40°C to 105°C, 113-NFBGA package.
| Parameter | Value |
|---|---|
| Series | MSP430F2xx |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C ~ 105°C (TA) |
| Speed | 16MHz |
| Package | Tape & Reel (TR) |
| RAM size | 4K x 8 |
| Core size | 16-Bit |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| Connectivity | I2C, IrDA, LINbus, SCI, SPI, UART/USART |
| Number of i (O) | 64 |
| Core processor | MSP430 CPU16 |
| Case | 113-VFBGA |
| Data converters | A/D 8x12b; D/A 2x12b |
| Program memory size | 92KB (92K x 8 + 256B) |
The MSP430F2616TZCAR: It runs at 16 MHz and packs 92 KB of Flash program memory plus 4K x 8 of RAM, with 64 I/O lines for peripheral-rich designs.
The 113-NFBGA package (7x7 mm) is a fine-pitch BGA requiring controlled assembly and X-ray inspection.
This qualifies the part for new-production BOMs and long-horizon programs without a forced redesign window.
It comes in a 113-VFBGA package (113-NFBGA, 7x7 mm body). This is a fine-pitch BGA — not socketed, not a field-swap part. Plan for controlled assembly and X-ray inspection.
The base product number is MSP430F2616; check the MSP430F2xx family for pin-compatible density variants in the same 113-NFBGA footprint, but verify the specific memory and peripheral match against your firmware image.