Package and supply — design-in checklist
The 64-LQFP footprint is common across the MSP430F2xx 64-pin variants, so a board layout can often accommodate multiple Flash/RAM density options without a respin.

Texas Instruments MSP430F2xx series, MSP430F2481TPM, 16-Bit Microcontroller, MSP430 CPU16 core, 16MHz, 48KB (48K x 8 + 256B) FLASH, 4K x 8 RAM, I²C/SPI/UART/LINbus/IrDA, 48 I/O, 1.8V~3.6V, -40°C~105°C, Surface Mount 64-LQFP (10x10), Tray.
| Parameter | Value |
|---|---|
| Series | MSP430F2xx |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C~105°C(TA) |
| Speed | 16MHz |
| Package | Tray |
| RAM size | 4K x 8 |
| Core size | 16-Bit |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Connectivity | I²C, IrDA, LINbus, SCI, SPI, UART/USART |
| Number of i (O) | 48 |
| Core processor | MSP430 CPU16 |
| Case | 64-LQFP |
| Program memory size | 48KB (48K x 8 + 256B) |
The 64-LQFP footprint is common across the MSP430F2xx 64-pin variants, so a board layout can often accommodate multiple Flash/RAM density options without a respin.
Buyers need to compare costs and budget for their BOM.
Availability determines procurement lead time and production schedule.
Engineers need datasheet for design validation and pin compatibility.
Lifecycle status affects long-term availability and product redesign decisions.
Finding alternatives is crucial for supply chain resilience and second sourcing.
Pinout is needed for PCB layout and integration with other components.