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Texas Instruments MSP430F2410TRGCR — Microcontrollers & Processors (MCU / MPU / DSP)

Texas Instruments MSP430F2410TRGCR 16-bit MCU, 56KB Flash

MPNMSP430F2410TRGCR
Active

Texas Instruments MSP430F2xx series, MSP430F2410TRGCR, 16-bit MCU, 56KB Flash, 4K x 8 RAM, 16MHz core, 48 I/O, I²C/SPI/UART, 1.8V–3.6V, -40°C to 105°C, 64-VQFN.

$13.4600Ref. price · indicative, final on quote
Packaging64-VFQFN Exposed Pad
RoHSROHS3 Compliant
SeriesMSP430F2xx
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MSP430F2410TRGCR specifications
ParameterValue
SeriesMSP430F2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size4K x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)48
Core processorMSP430 CPU16
Case64-VFQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size56KB (56K x 8 + 256B)

Product details

16 MHz MSP430 core with 56 KB Flash — what the memory budget buys

The 48 general-purpose I/O lines give enough headroom for parallel LCD data buses or a bank of discrete sensor inputs without an external port expander.

At the low end of the supply, the 16 MHz core still executes with one flash wait state — budget that in your cycle-count timing for tight loops.

The 105°C ceiling is the practical limit for sealed enclosures with no active cooling; above that, you are looking at a different temperature-grade tier.

I²C, SPI, UART — peripheral set for sensor and display buses

For a typical design, the I²C bus handles a temperature/humidity sensor and an EEPROM, while the SPI port drives an OLED display or a radio transceiver. The LINbus peripheral is useful for automotive sub-networks where a single twisted pair replaces a heavier harness.

The ROHS3 compliance is current. The base product number is MSP430F2410, which covers the full family variants.

64-VQFN package — footprint and reflow considerations

Housed in a 64-VFQFN exposed-pad package (9x9 mm body), the MSP430F2410TRGCR is a surface-mount device. The exposed thermal pad under the package needs a via array to the ground plane to pull heat from the die — without it, junction temperature climbs faster under continuous 16 MHz operation at the 105°C ambient corner.

Frequently asked questions

Does MSP430F2410TRGCR support I2C and SPI?

The I²C and SPI buses are available on dedicated pins, configurable through the peripheral registers.

Is MSP430F2410TRGCR RoHS compliant?

Yes, it is ROHS3 Compliant per the lifecycle record. No exemption issues for lead-free reflow profiles.