The 48 general-purpose I/O lines and integrated peripherals — Brown-out Detect/Reset, POR, PWM, and WDT — reduce external glue logic for a compact BOM.
Serial connectivity and data conversion
Supplied in a 64-LQFP package (10x10 mm body) with surface-mount termination. The tray shipping format is typical for production runs; the 0.5 mm pitch requires standard SMT assembly equipment. No exposed thermal pad — dissipation relies on the leadframe and board copper.
It is ROHS3 compliant.
