The 64-VFQFN package with an exposed thermal pad (9x9 mm body) helps pull heat out of the die when the core is active continuously; the pad should be stitched to a ground plane with at least four vias to keep junction temperature in check at the high end of the range.
MSP430F233TRGCT
Texas Instruments · MSP430F2xx Series
Texas Instruments MSP430F2xx series, MSP430F233TRGCT, 16-bit MCU, 16 MHz, 8 KB Flash, 1K x 8 RAM, 48 I/O, I²C/SPI/UART/LINbus, 8x12b ADC, -40°C to 105°C, 64-VQFN.
[IN STOCK] In Stock: 15 pcs
MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T
Technical specifications
| Parameter / Attribute | Specification / Value |
|---|---|
| Series | MSP430F2xx |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C~105°C(TA) |
| Speed | 16MHz |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| RAM size | 1K x 8 |
| Core size | 16-Bit |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Connectivity | I²C, IrDA, LINbus, SCI, SPI, UART/USART |
| Number of i (O) | 48 |
| Core processor | MSP430 CPU16 |
| Case | 64-VFQFN Exposed Pad |
| Data converters | A/D 8x12b |
| Program memory size | 8KB (8K x 8 + 256B) |
Technical details
MSP430F233TRGCT
[ALLOC] verified