Obsolete — sourcing reality for the BOM line
The MSP430F2254IYFFR comes in a 49-ball DSBGA package measuring 2.8 x 2.8 mm — a fine-pitch BGA that requires a controlled assembly process with solder-paste stencil and reflow profile.

Texas Instruments MSP430F2254IYFFR, 16-bit MSP430 CPU16 MCU, 16 MHz, 16 KB Flash, 512 x 8 RAM, 32 I/O, I²C/SPI/UART/USART, 12x10b ADC, 1.8 V–3.6 V, -40°C to 85°C, 49-DSBGA (2.8x2.8 mm), Tape & Reel.
| Parameter | Value |
|---|---|
| Series | MSP430F2xx |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 16MHz |
| Package | Tape & Reel (TR) |
| RAM size | 512 x 8 |
| Core size | 16-Bit |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Connectivity | I²C, IrDA, LINbus, SCI, SPI, UART/USART |
| Number of i (O) | 32 |
| Core processor | MSP430 CPU16 |
| Case | 49-UFBGA, DSBGA |
| Data converters | A/D 12x10b |
| Program memory size | 16KB (16K x 8 + 256B) |
The MSP430F2254IYFFR comes in a 49-ball DSBGA package measuring 2.8 x 2.8 mm — a fine-pitch BGA that requires a controlled assembly process with solder-paste stencil and reflow profile.
Yes, Texas Instruments has marked the MSP430F2254IYFFR as obsolete. No further production is planned, and the part is available only through independent surplus and broker channels. Sourcing is quoted to order against an RFQ.
Texas Instruments does not list a direct official successor for this specific order code. A functionally equivalent replacement would need to come from the MSP430F2xx family with the same 16 MHz core, 16 KB Flash, 49-DSBGA package, and peripheral set — but pin compatibility and firmware migration must be verified against the original design.