It carries 16 KB of Flash program memory (16K x 8 plus 256 B) and 512 x 8 of RAM — enough for moderate sensor-fusion or control loops without external memory.
Peripherals and connectivity — what is wired in
There are 32 I/O lines available in the 38-TSSOP package.
Package and mounting — 38-TSSOP footprint
Supplied in a 38-TSSOP (0.240", 6.10 mm width) surface-mount package, the MSP430F2252TDA is a standard fine-pitch SOIC-like footprint. The supplier device package is 38-TSSOP. The part ships in Tube form. Mounting is surface mount, compatible with reflow soldering.
