The MSP430F2252IRHAR: It carries 16 KB of Flash program memory (16K x 8 plus 256 B of information memory) and 512 x 8 of RAM — enough for sensor fusion, control loops, or simple protocol stacks in battery-operated or industrial designs.
This is not an automotive-qualified (AEC-Q100) part, so under-hood or chassis-domain designs should look at the MSP430 automotive family instead.
Package and footprint — 40-VFQFN with exposed pad
Housed in a 40-VFQFN with exposed pad (6x6 mm body), the part requires a thermal-via stitch under the pad to carry heat and provide a low-impedance ground connection. The supplier device package is 40-VQFN (6x6). Surface-mount only; no through-hole option.
This part is current-production and can be sourced through franchised distribution or independent channels.