MSP430F2132QRHBTEP

Texas Instruments

Texas Instruments MSP430F2xx 16-bit MCU, MSP430F2132QRHBTEP, 16 MHz, 8 KB Flash, 512 B RAM, 25 I/O, -40°C to 125°C, 32-VQFN (5x5) exposed pad, 1.8 V to 3.6 V supply.

Texas Instruments MSP430F2132QRHBTEP
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[IN STOCK] In Stock: 2 pcs
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

MSP430F2132QRHBTEP specifications
Parameter / AttributeSpecification / Value
SeriesMSP430F2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~125°C(TA)
Speed16MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size512 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, IrDA, LINbus, SCI, SPI, UART/USART
Number of i (O)25
Core processorMSP430 CPU16
Case32-VFQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size8KB (8K x 8 + 256B)

Technical details

16 MHz, 8 KB Flash, 512 B RAM — what the memory budget means

The 25 I/O lines, plus I²C, SPI, UART, IrDA, and LINbus connectivity, cover most serial-bridge and data-logging roles.

The EP suffix flags it as an extended-temperature / enhanced-product variant — not a commercial-grade part in an industrial wrapper.

32-VQFN (5x5) with exposed pad — layout and thermal handling

The 32-VQFN package (5x5 mm body) with exposed thermal pad needs a via-stitched ground paddle on the PCB to pull heat out of the die. Surface-mount only — no socket option.

At the low end, 1.8 V operation keeps the core alive during battery exhaustion — useful for last-gasp data logging.

This is a standard catalog part, not a phase-out or NRND line. The MSP430F2xx family has been in volume for years, so second-source risk is low: TI is the sole fab, but the architecture is stable and widely supported.

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