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Texas Instruments MSP430F2121TDGV — Microcontrollers & Processors (MCU / MPU / DSP)

TI MSP430F2121TDGV 16-Bit MCU, 16 MHz, 4 KB Flash, NRND

MPNMSP430F2121TDGV
NRND

Texas Instruments MSP430F2xx series, MSP430F2121TDGV, 16-Bit MSP430 CPU16, 16MHz, 4KB (4K x 8 + 256B) FLASH, 256 x 8 RAM, 16 I/O, 20-TFSOP, -40°C~105°C.

$2.2656Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

MSP430F2121TDGV specifications
ParameterValue
SeriesMSP430F2xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed16MHz
PackageTube
RAM size256 x 8
Core size16-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
Number of i (O)16
Core processorMSP430 CPU16
Case20-TFSOP (0.173\", 4.40mm Width)
Data convertersSlope A/D
Program memory size4KB (4K x 8 + 256B)

Product details

16 MHz MSP430 CPU16 — what the core speed means for your BOM

The 16 MHz ceiling sets the timing budget for the firmware loop. At that clock rate, a single-cycle instruction executes in 62.5 ns. For a UART bit-bang at 115200 baud, that gives about 138 core cycles per bit — comfortable margin. If your application needs tighter interrupt latency or higher throughput, the MSP430F2xx family offers faster parts, but for a 4 KB Flash footprint this speed is well matched to the code size.

That means TI is not actively promoting it for new projects, though it remains available for existing production runs. For a new BOM line, you would typically evaluate a current MSP430F2xx or MSP430G2xx device with similar Flash and RAM — the MSP430F2121IDGV (the industrial-temperature variant) is the same die in the same package, just with a different temperature suffix. If you are already shipping this part, the NRND flag is a signal to plan a qualification cycle for a drop-in or near-drop-in replacement before TI issues a last-time-buy notice.

20-TFSOP package — board footprint and thermal reality

The device is supplied in a 20-TFSOP package (0.173" body width, 4.40 mm) with a surface-mount footprint. No exposed thermal pad — all dissipation goes through the leads.

Frequently asked questions

Does MSP430F2121TDGV have a DAC?

No. The data converters listed are Slope A/D only — a simple successive-approximation ADC implemented with an external resistor and capacitor. There is no DAC peripheral on this part.